• Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
  • Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
  • Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
  • Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
  • Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
  • Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine

Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine

After-sales Service: Online
Warranty: 1 Year
Type: Small Vacuum Plasma Cleaner
Weight: 0-100Kg
Power Source: AC220V
Transport Package: Plywood Case
Customization:
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Basic Info.

Model NO.
LRGD-10
Specification
250mm *75mm *270mm (L*W*H)
Trademark
LONROY
Origin
China
HS Code
9024800000
Production Capacity
200pieces/Month

Product Description

Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine
Product parameter
Product name Vacuum plasma cleaner
Product model GD-10
Power supply AC220V(±10V)
Power supply 100w-300w
Cavity size (mm) 560X550X400mm(WXDXH)
Operating frequency 40 KHZ and 13.56 MHz (Option)
Air source pressure 2-2.5 kg
weight 100kg
Use gas Nitrogen, oxygen, nitrogen, air
Connection length

2m-4m

Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine
Functional characteristics

Product surface modification
The modification of Fangrui plasma equipment can effectively reduce the influence factors of material pretreatment by 95%

Product surface activation
The surface activation rate of the materials pretreated with Fangrui plasma equipment is 98%

Product surface cleaning
The modification of Fangrui plasma equipment can effectively reduce the influence factors of material pretreatment by 95%

Product surface bonding
The adhesion of the material surface was improved by 92% by using Fangrui plasma equipment

Application of multiple industries
Suitable for 95% industry, strong compatibility
Automobile manufacturing industry
Mobile phone manufacturing industry
Textile printing and dyeing industry
Semiconductor packaging industry
Heavy industry
New energy industry
FBC/PCB field
Medical industry

Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine
First, the advantages of vacuum equiseparation cleaning machine

Compared with traditional processes, plasma surface treatment technology has the following advantages:
[Strong function] : Modification only occurs on the surface of the material (about a few to dozens of nanometers), without changing the inherent properties of the matrix
To give one or more new functions;
[Wide application] : regardless of the substrate type of the treatment object, such as metal, plastic, glass, polymer materials, etc., can be processed;
[Easy to operate] : simple process, easy to operate, strong production control and high stability;
[High efficiency] : short treatment time, high reaction rate, good treatment uniformity;
[Energy saving, environmental protection] : The whole process of dry treatment, no consumption of water resources, no need to add chemical agents, no pollution.
Two, product introduction
RD-10 Vacuum plasma cleaning machine is a vacuum reaction chamber can rotate 360° cleaning machine, widely used in small batch production of enterprises or universities for scientific research. The whole machine is compact, stable performance, uniform and stable treatment effect, high cost performance, vacuum reaction chamber can rotate 360°, 360° without dead Angle processing granular products and small irregular products.
1. Equipment composition
Plasma cleaning machine is composed of reaction chamber (also known as vacuum chamber), vacuum system, discharge system, electric control system, intake flow control system.
The reaction chamber consists of a vacuum chamber and an electrode, which is a plasma reaction space. The items to be treated are placed in the reaction chamber. The vacuum system consists of a vacuum gauge, a vacuum pump and a vacuum pipe, which is responsible for purifying the air in the reaction chamber and maintaining an appropriate vacuum degree during operation. The discharge system provides signal and energy for the reaction chamber to stimulate the ionization of the reaction gas in the chamber to form the plasma needed. The function of the electronic control system is to control the operation process of the equipment according to the optimal process parameters and steps, and maintain the stability of the process parameters; The intake flow control system is mainly composed of mass flowmeters and electromagnetic valves. Its function is to accurately control the intake flow of the reaction gas and maintain the vacuum required during the working period.
The device uses a touch screen +PLC programmable controller, processing parameters can be arbitrarily set on the touch screen, with manual/automatic switching function. The automatic operation adopts "one key type", and the working process is completely controlled by the computer automatically. Manual operation is performed by the user on the manual mode interface.

 
Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine
number Item type Specific parameter
1 Plasma generator

Intermediate frequency 40Khz Intermediate frequency power 100~300W
Equipped with imported touch screen panel control, to meet user requirements

2 Plasma reaction control software Fang Rui technology independently developed proprietary software V1.0

Fully automatic system control

3 Vacuum chamber Cavity internal size: Φ210*300mm
Chamber material: 304 stainless steel material
4 Vacuum reaction chamber

Cavity internal size: Φ160*230mm

Chamber material: 304 stainless steel material

5 electrode

Design of cylindrical electrode structure.

Reaction volume: 5L

6 Vacuum pump

Bipolar direct rotary vane vacuum pump pumping rate: 14.4m3/H

Limit vacuum: 6*10-2Pa Power: 0.55KW

7

Pipes and components

Vacuum pipe: 304 stainless steel vacuum corrugated pipe

Working gas pipeline components: PVC transparent hose +304 stainless steel connectors to ensure efficient operation and reliability of the equipment.

8 Vacuum gauge Japanese Panasonic digital display table
9 Gas control 2 way process gas, solenoid valve control, mechanical manual adjustment 0.1 ~ 1NL/min
10 Plasma process gas Support two process gas: argon, oxygen (argon, oxygen, nitrogen, hydrogen, carbon tetrafluoride optional)
11 Control mode 4.3 "industrial control touch screen, real-time display of working status
12 Vacuuming time 30s pressure <50Pa
13 Vacuum breaking system

Solenoid valve + silencer

Vacuum breaking time: 30s

14

Single processing time

1-30 minutes (depending on product characteristics, power and time Settings are different)
15 Electrode material Custom 304 stainless steel electrodes
16 Other parameters

Power supply: AC220V(±10V)

Machine size: W700×D640×H475mm (for reference)

Machine weight: 55kg

Machine: High - quality anti - rust paint

17 Motor speed range <10 turns /min

Small Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment MachineSmall Vacuum Plasma Cleaner, Etcher for Electronic Products, Vacuum Plasma Surface Treatment Machine
 

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